Diamond lapping films provide less polishing relief than intermediate rough polishing cloths and provide a fixed diamond grinding mode. Diamond lapping films are exceptional abrasives for preparing microelectronic materials for SEM and TEM analysis.
Silicon carbide lapping films are bonded or coated abrasive films of SiC designed so that the abrasive will have a large number of cutting points (negative abrasive rank angle). This is achieved by aligning the abrasive particles approximately normal to the backing. Note that coated abrasives are not quite coplanar, thus SiC papers produce the maximum efficiency (cut rate, stock removal and minimal damage) because new abrasive is exposed as the old abrasive breaks down.
Silicon carbide lapping films are bonded or coated abrasive films of SiC designed so that the abrasive will have a large number of cutting points (negative abrasive rank angle). This is achieved by aligning the abrasive particles approximately normal to the backing. Note that coated abrasives are not quite coplanar, thus SiC papers produce the maximum efficiency (cut rate, stock removal and minimal damage) because new abrasive is exposed as the old abrasive breaks down.