The LP-66 Cerium Oxide Polishing Pad is the industry-leading choice for ultra-precise polishing of glass, optics, and semiconductor surfaces. Crafted from hydrophobic polyurethane infused with cerium oxide, it combines rapid material removal with minimal heat generation, making it ideal for applications demanding sub-micron accuracy and critical tolerances.
Key Features
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Cerium Oxide-Infused: Delivers high-speed polishing with a mirror-like finish for glass, LCD/LED substrates, and semiconductor wafers.
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Hydrophobic Design: Resists water absorption for consistent performance in wet/dry workflows.
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Low Heat & Friction: Minimizes thermal distortion during polishing of heat-sensitive materials like precision optics and ophthalmic lenses.
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Versatile Geometry: Adapts to unique contours for complex shapes and tight tolerances.
Applications
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Optics & Photonics: Polish precision lenses and optical components.
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Semiconductor Manufacturing: Finish silicon wafers and hard disk surfaces.
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Glass & Display Tech: Refine LCD/LED substrates and architectural glass.
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Metal Finishing: Achieve flawless surfaces on hardened alloys.
Technical Advantages
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Superior to Synthetic Pads: 30% faster polishing with 50% less heat generation.
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Durable Polyurethane: Retains shape under pressure for repeatable results.
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Multi-Industry Compliance: Meets standards for aerospace, medical, and electronics sectors.
Why Choose the LP-66?
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Efficiency: Reduces polishing time while maintaining surface integrity.
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Precision: Engineered for critical tolerances in high-value applications.
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Versatility: Compatible with automated systems or manual polishing tools.
Ideal For: Optics engineers, semiconductor manufacturers, and glass artisans.
Explore the LP-66 Polishing Pad to elevate your precision finishing workflows.