101mm x 10M Silicon Dioxide Lapping Film Roll – 0.2μm for Precision Glass, Semiconductor & Optical Finishing

The 101mm x 10M Silicon Dioxide Lapping Film Roll (0.2μm) is an ultra-fine precision sub-micron abrasive roll engineered for continuous automated polishing of optical components, fiber optic connectors, and semiconductor substrates.

Key Features

• Sub-Micron SiO2 Particles (0.2μm): High-purity colloidal silicon dioxide abrasive particles achieve atomic-level smoothness and sub-angstrom scratch-free surface finishes.
• Continuous Roll Format (101mm Width x 10M Length): Standard 4-inch width fits industrial automated roll-feed polishing equipment, or can be cleanly cut to custom shapes.
• Precision Polyester Backing: Uniform, heavy-duty Mylar film base prevents tearing, stretching, or orange-peel ripples during wet continuous-feed operations.
• Reliable Defect-Free Surface: Minimizes sub-surface damage on fragile crystalline structures and precision optical glasses.

Recommended Applications

• Final stage polishing of fiber optic connector end faces (UPC and APC standards).
• Planarization and final polishing of semiconductor wafers and optical crystals.
• Laser optics, quartz prisms, and scientific optical flat fabrication.
• Gemstone facet mirror finishing on transparent silicate minerals.

Operating Guidelines

• Feed through automated lapping machine or mount to a smooth platen with clean water or specialized lubricant.
• Ensure strict contamination control; keep work area free from coarser abrasive particulates.
• Run under light, uniform pressure to achieve uniform optical surface quality.