Silicon Carbide and Silicon Dioxide lapping films feature a mylar film substrate coated with resin-bonded abrasive particles. Designed for fine grinding and precision lapping, these films excel in applications demanding sharp edge retention and minimal subsurface damage.
Key Features:
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Micron-Graded Abrasives: Precision finishes from 30 to 1 micron for controlled material removal.
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Uniform Backing: Ensures sample planarity and consistency across encapsulated/non-encapsulated samples.
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Chemical Resistance: Resists water, oil, and solvents for robust performance in wet/dry workflows.
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Color-Coded Identification: Streamlines grit selection for high-throughput labs.
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Power Head Limitation: Not suited for power-driven systems.
Material-Specific Recommendations:
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Silicon Carbide (SiC): Optimized for non-ferrous metals and polymers, offering aggressive cutting with minimal loading.
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Silicon Dioxide (SiO₂): Ideal for brittle materials like glass and ceramics, delivering scratch-free finishes.
Applications:
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Semiconductor Prep: Final polishing of wafers and microelectronic components.
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Optics & Photonics: Surface finishing for fiber connectors and laser optics.
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Metallography: Achieving mirror-like surfaces for microscopic analysis.