6" 10pcs 0.01um SiO Precision Lapping Films Disc

Silicon Carbide and Silicon Dioxide lapping films feature a mylar film substrate coated with resin-bonded abrasive particles. Designed for fine grinding and precision lapping, these films excel in applications demanding sharp edge retention and minimal subsurface damage.

Key Features:

• Micron-Graded Abrasives: Precision finishes from 30 to 1 micron for controlled material removal.

• Uniform Backing: Ensures sample planarity and consistency across encapsulated/non-encapsulated samples.

• Chemical Resistance: Resists water, oil, and solvents for robust performance in wet/dry workflows.

• Color-Coded Identification: Streamlines grit selection for high-throughput labs.

• Power Head Limitation: Not suited for power-driven systems.

Material-Specific Recommendations:

• Silicon Carbide (SiC): Optimized for non-ferrous metals and polymers, offering aggressive cutting with minimal loading.

• Silicon Dioxide (SiO₂): Ideal for brittle materials like glass and ceramics, delivering scratch-free finishes.

Applications:

• Semiconductor Prep: Final polishing of wafers and microelectronic components.

• Optics & Photonics: Surface finishing for fiber connectors and laser optics.

• Metallography: Achieving mirror-like surfaces for microscopic analysis.