Engineered for precision grinding and edge retention, these lapping films combine a mylar film backing with resin-bonded abrasives for critical surface preparation.
Key Features
- Micron-Graded Abrasives: Premium silicon carbide or silicon dioxide particles (30–1µm) ensure precise, repeatable finishes.
- Durable Backing: Uniform thickness and planarity for consistent results on encapsulated or bare samples.
- Chemical Resistance: Withstands water, oil, and solvents for industrial workflows.
- Color-Coded Grits: Rapid identification of abrasive grades.
- Application Flexibility: Ideal for non-ferrous metals, polymers, and brittle substrates.
⚠️ Note: Not recommended for power head systems.
Material-Specific Recommendations
| Material | Recommended Abrasive | Key Applications |
|---|---|---|
| Non-Ferrous Metals | Silicon Carbide | Deburring, edge retention, and surface smoothing. |
| Polymers | Silicon Carbide | Minimizing heat-induced deformation during finishing. |
| Brittle Substrates | Silicon Dioxide | Low-aggression polishing for glass or ceramics. |
Usage Tips
- Surface Prep: Clean samples thoroughly to avoid embedding contaminants.
- Lubrication: Use coolants for heat-sensitive materials.
- Pressure Control: Adjust force based on hardness (e.g., soft polymers vs. hard metals).
Why Choose These Films?
- Edge Preservation: Critical for metallography and microelectronics.
- Cost Efficiency: Longer lifespan vs. traditional aluminum oxide abrasives.
- Customization: Available in tailored sizes or adhesives (e.g., PSA-backed).
Explore our lapping film range or contact us for specialized configurations.