7330mm Diamond Wire Loop Saw – Precision Tire Section Cutting & Inspection Tool

The Diamond Loop Wire Saw is engineered for precision cutting applications across industries such as semiconductor, optics, ceramics, and advanced materials. Manufactured with premium diamond grit and a flexible continuous loop design, it delivers high cutting speed, exceptional accuracy, and smooth edges without secondary processing.

Key Features

• Continuous Loop Design – Enables uninterrupted cutting with consistent accuracy.
• Premium Diamond Abrasives – Ensures fast material removal and long service life.
• Versatile Cutting – Ideal for hard and brittle materials such as quartz, sapphire, silicon, ceramics, glass, and crystals.
• High Efficiency – Supports high-speed cutting with minimal vibration, reduced noise, and superior edge quality.
• Cost-Effective – Extended lifespan reduces downtime and replacement costs.

Applications

• Semiconductor Industry – Wafer slicing and crystal cutting.
• Optics & Glasswork – Precision cutting of lenses, quartz, and specialty glass.
• Ceramics & Composites – High-accuracy sectioning of brittle materials.
• Research & Development – Suitable for laboratory material analysis and prototyping.

With its clean cutting performance and extended durability, the diamond loop wire saw is the preferred choice for industries demanding high-precision sectioning and reduced processing steps.