7330mm Diamond Wire Loop Saw for Tire Section Cutting Inspection

The Diamond Loop Wire Saw is engineered for precision cutting applications across industries such as semiconductor, optics, ceramics, and advanced materials. Manufactured with premium diamond grit and a flexible continuous loop design, it delivers high cutting speed, exceptional accuracy, and smooth edges without secondary processing.

Key Features

• Continuous Loop Design – Enables uninterrupted cutting with consistent accuracy.
• Premium Diamond Abrasives – Ensures fast material removal and long service life.
• Versatile Cutting – Ideal for hard and brittle materials such as quartz, sapphire, silicon, ceramics, glass, and crystals.
• High Efficiency – Supports high-speed cutting with minimal vibration, reduced noise, and superior edge quality.
• Cost-Effective – Extended lifespan reduces downtime and replacement costs.

Applications

• Semiconductor Industry – Wafer slicing and crystal cutting.
• Optics & Glasswork – Precision cutting of lenses, quartz, and specialty glass.
• Ceramics & Composites – High-accuracy sectioning of brittle materials.
• Research & Development – Suitable for laboratory material analysis and prototyping.

With its clean cutting performance and extended durability, the diamond loop wire    saw is the preferred choice for industries demanding high-precision sectioning and reduced processing steps.