Diamond Lapping Film Discs are recommended for carbides, ceramics, fiber optics, wafers, microelectronic devices, in addition to petrographic and high hardness metals where critical surface flatness is required. Premium graded continuous diamond particles are resin bonded to highly uniform polyester film resulting in consistent performance for ultimate flatness and finish. Suitable for wet or dry applications with Pressure Sensitive Adhesive (PSA) or Plain Back from 0.1 micron to 30 micron.Diamond Lapping Film (continuous and interrupted) is available for a variety of wet or dry (W/D) applications and with Pressure Sensitive Adhesive (PSA) or plain backing. Special size orders are also available.Standard Diamond Lapping Film consists of precision graded diamond particles resin bonded to a uniform mylar film. They provide excellent edge retention and maintain coplanarity regardless of varying materials or hardness within the sample. Typically used for unencapsulated cross-sectioning, TEM wedge/plan-view polishing, backside polishing and FIB sample thinning.