What is the difference between diamond, SiC, AlOx, and SiO₂ lapping film?

Diamond (Mohs 10): fastest, for hard gems and carbide. SiC (Mohs 9-10): sharp cutting for metals and brittle substrates. AlOx (Mohs 8-9): controlled removal for optics and semiconductors. SiO₂ (0.2μm): final sub-micron mirror polish for optical glass and silicon wafers.

When should I use lapping film rolls versus discs or sheets?

Discs for flat lap machines. Sheets for hand lapping and custom cutting. Narrow rolls (30-55mm) for fiber optic polishing. Wide rolls (101mm) for production environments and custom disc cutting.

What micron grade should I start with for a complete lapping sequence?

Start at 15-30μm for coarse removal, progress through 5-9μm, then 1-3μm, finish with 0.3-0.5μm. For optical mirror finish, complete with 0.2μm SiO₂ or 0.3μm CeO₂.

Can lapping film be used on a standard flat lap machine?

Yes — PSA-backed discs mount on flat lap platens or backing plates. Plain discs use water tension or spray adhesive on glass plates.

What is silicon dioxide (SiO₂) lapping film used for?

SiO₂ film (0.2μm) is for final sub-micron polishing of optical glass and silicon wafers. Its chemomechanical action delivers optical-quality mirror finishes without introducing new surface defects.

Collection: Abrasive Polishing Laps

Abrasive Lapping Film – Precision Discs, Rolls & Sheets for Optics, Semiconductors & Lapidary

Complete range of precision abrasive lapping film in four abrasive types — diamond, silicon carbide (SiC), aluminium oxide (AlOx), and silicon dioxide (SiO₂) — available in disc, roll, and sheet formats. Resin-bonded abrasive on polyester or Mylar film backing delivers consistent, controlled material removal from coarse lapping through sub-micron mirror finishing. Micron range: 0.2μm to 80μm. Applications include semiconductor wafers, optical components, fiber optics, microelectronics, metallography, ceramics, and lapidary.

🔥 Shop Abrasive Lapping Film – Discs, Rolls & Sheets

Product Format Guide

Format	Sizes	Abrasive Types	Price From	Best For
Discs (10-pack)	6", 8"	SiC, AlOx	$16.00	Flat lap machines, backing plates, PSA or plain mount
Sheets (5-pack)	280×220mm	Diamond, SiC, AlOx	$16.00	Hand lapping, glass plates, custom cutting to size
Rolls (narrow)	30mm×10M, 55mm×20M	Diamond	$100.00	Fiber optic polishing, narrow-format precision lapping
Rolls (wide, 101mm)	5M, 10M, 45M	Diamond, SiC, AlOx, SiO₂	$38.00	Production lapping, custom disc cutting, roll-to-roll systems

Abrasive Type Selection Guide

Abrasive	Hardness	Micron Range	Best For
Diamond	Mohs 10	0.5–80μm	Hard gems (Mohs 7+), carbide, sapphire, hard ceramics — fastest cutting, longest life
Silicon Carbide (SiC)	Mohs 9–10	1–60μm	Non-ferrous metals, polymers, brittle substrates, glass — sharp, friable cutting action
Aluminium Oxide (AlOx)	Mohs 8–9	0.3–60μm	Optical components, semiconductors, fiber optics, medium-hard gems — controlled removal
Silicon Dioxide (SiO₂)	Mohs 7	0.2μm only	Final sub-micron mirror polish on optical glass, silicon wafers, precision surfaces

Compatible Applications

Semiconductor wafers, MEMS, ceramic capacitors, hard drive read-write heads
Optical components: lenses, prisms, fiber optic connectors, laser components
Metallography and petrographic sample preparation
Advanced composites and brittle substrate lapping
Lapidary gemstone pre-polish and final polish sequences

Related Tools

Diamond Lapping Film Discs — Diamond abrasive discs for hard gem and precision optical lapping
Silicon Carbide Lapping Film Discs — SiC discs for non-ferrous metals and brittle substrates
Aluminium Oxide Lapping Film Discs — AlOx discs for optical and semiconductor precision lapping
Cerium Oxide Polishing Pads — CeO₂ pads for final mirror polish after lapping film sequence
Master Support Laps — Precision flat support laps for mounting lapping film discs
Silicon Dioxide Lapping Film — SiO₂ rolls for sub-micron final polish on optical glass and silicon wafers

Frequently Asked Questions

Q: What is the difference between diamond, SiC, AlOx, and SiO₂ lapping film?
A: Diamond film (Mohs 10) is the hardest and fastest-cutting — ideal for hard gems (Mohs 7+), carbide, and sapphire. SiC film (Mohs 9–10) has a sharp, friable cutting action suited for non-ferrous metals, polymers, and brittle substrates. AlOx film (Mohs 8–9) delivers controlled material removal for optical components and semiconductor applications. SiO₂ film (0.2μm only) is used exclusively for final sub-micron mirror polishing of optical glass and silicon wafers.
Q: When should I use lapping film rolls versus discs or sheets?
A: Discs (6"/8", 10-pack) are ideal for flat lap machines with PSA or plain backing plate mounting. Sheets (280×220mm, 5-pack) suit hand lapping on glass plates and can be cut to custom sizes. Narrow rolls (30mm/55mm) are designed for fiber optic connector polishing. Wide rolls (101mm, 5M–45M) are for production lapping environments, roll-to-roll systems, and custom disc cutting.
Q: What micron grade should I start with for a complete lapping sequence?
A: Start at 15–30μm for coarse stock removal and scratch elimination, progress through 5–9μm for intermediate refinement, then 1–3μm for fine lapping, and finish with 0.3–0.5μm for near-mirror quality. For optical-grade mirror finish, complete with 0.2μm SiO₂ or 0.3μm CeO₂ film as the final stage.
Q: Can lapping film be used on a standard flat lap machine?
A: Yes — PSA-backed discs mount directly on flat lap platens or backing plates. Plain discs can be mounted with water tension on glass plates or with spray adhesive. For magnetic quick-change systems, use PSA-backed discs on a compatible backing plate adapter.
Q: What is silicon dioxide (SiO₂) lapping film used for?
A: Silicon dioxide lapping film (0.2μm) is used exclusively for the final sub-micron polishing stage on optical glass, silicon wafers, and precision optical surfaces where the absolute finest surface quality is required. It is softer than AlOx or diamond film and produces a chemomechanical polishing action that delivers optical-quality mirror finishes without introducing new surface defects.