Kolekcja: Cerium Oxide Resin Products

Cerium Oxide Resin Polishing Pads – LP-66 Polyurethane Pads for Glass, Optics & Lapidary

Professional LP-66 series polyurethane cerium oxide polishing pads engineered for precision polishing of glass, optical lenses, LCD substrates, silicon wafers, gemstones, and lapidary materials. Constructed from hydrophobic polyurethane infused with cerium oxide — delivering rapid material removal with ultra-low friction and minimal heat generation. Available in plain and grooved designs from 6" to 24" diameter, with magnetic, PSA sticker, and plain backing options.

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Product Range & Pricing

Diameter Style Magnetic PSA Plain
6" Plain & Grooved $10.00 $7.50 $7.00
8" Plain & Grooved $15.00 $12.50 $12.00
10" Plain & Grooved $25.00 $20.00 $19.00
12" Plain & Grooved $28.00 $25.00 $24.00
14" Plain & Grooved $30.00 $25.00 $24.00
16" Plain & Grooved $35.00 $30.00 $30.00
18" Plain & Grooved $55.00 $45.00 $45.00
24" Plain & Grooved $65.00 $55.00 $55.00

Key Features

  • LP-66 hydrophobic polyurethane construction — infused with cerium oxide for consistent polishing action
  • Rapid material removal with ultra-low friction and minimal heat — safe for heat-sensitive optical materials
  • Grooved pad design improves slurry flow and prevents pad loading during extended polishing sessions
  • Magnetic backing for instant attachment to magnetic flat lap plates (Genie, Titan, and similar)
  • PSA sticker backing for secure mounting on standard flat lap platens
  • Suitable for optical lenses, LCD substrates, silicon wafers, gemstones, glass, and auto detailing

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Frequently Asked Questions

  • Q: What is the advantage of the LP-66 polyurethane pad over standard felt or leather pads?
    A: The LP-66 hydrophobic polyurethane construction generates significantly less heat than felt or leather pads during polishing, making it ideal for heat-sensitive materials like optical lenses, LCD substrates, and silicon wafers. The cerium oxide infusion also provides more consistent polishing action without requiring separate compound application.
  • Q: What is the difference between plain and grooved LP-66 pads?
    A: Grooved pads have channels cut into the surface that improve cerium oxide slurry circulation during polishing, reducing heat buildup and preventing pad loading. Plain pads provide a larger uninterrupted polishing surface, better suited for smaller workpieces and general lapidary polishing.
  • Q: Do these pads require additional cerium oxide compound?
    A: The LP-66 pads are infused with cerium oxide and can be used with water alone for light polishing. For faster material removal or final mirror polishing, applying additional cerium oxide powder or slurry to the pad surface will enhance polishing performance.